This project brief describes how to build a compact dual-channel power amplifier module that delivers 38 W per channel into 4-ohm speakers using STMicroelectronics' STA540 audio amplifier IC.
Explore how frequency-modulated waves resist interference. We break down the demodulator architecture and derive the exact output signal power for a sinusoidal message.
Accurate short-range (≤ 11 m) single- and multi-zone dToF measurement featuring TMF8829 and TMF8806 sensors.
The new modular 1RU cybersecurity test platform, delivers 400 Gbps throughput for validating modern AI and hyperscale network infrastructure under heavy traffic demands.
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Learn how dynamic satellite channel emulation enables realistic and repeatable testing of satellite communication systems for LEO, MEO, GEO and 5G NTN applications.
The PM1763 pairs a newly developed 4-nm controller with ninth-generation V-NAND, more than doubling the throughput of Samsung's fastest PCIe 5.0 enterprise drive.
Sparsity-based model compression from the Neuronix AI Labs acquisition promises up to 2x faster CNN inference on low-power, SEU-immune hardware.
New HBM, UFS, NAND, and EEPROM devices span the storage stack.
Announced today, the new Ryzen AI Embedded X100 Series and Kria AI platform unify CPU, GPU, and NPU compute to provide the low-latency performance and…
Hidden upstream dependencies can turn great product designs into costly delays. Discover why component sourcing risk must now be factored into early product decisions.
The USC-run service that pioneered multi-project wafers in 1981 now offers a path from shared shuttle runs to full production on GlobalFoundries' FinFET and…
Build a low-noise, 32-bit delta-sigma ADC board designed around the ADS1262. This 10-channel design features integrated signal conditioning for RTDs,…
In this Q&A with Vicor, we explore current multiplication and decoupled conversion stages. Both overcome traditional multiphase limitations and drastically cut…
Embedded industry pioneer Christian Eder, co-founder of congatec, joins Daniel Bogdanoff to discuss 30 years of modular design, open standards like COM-HPC, and…
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